Reliability of RoHS-Compliant 2D and 3D IC interconnects

Reliability of RoHS-Compliant 2D and 3D IC interconnects

Bibliografiske detaljer
Hovedforfatter: Lau, John H.
Format: Electronic Resource
Sprog:English
Udgivet: New York, N.Y. McGraw-Hill c2011.
Udgivelse:First edition.
Fag:
Interconnects (Integrated circuit technology) > Reliability.
Green technology > Reliability.
Electronic books.
Online adgang:Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy