Reliability of RoHS-Compliant 2D and 3D IC interconnects

Reliability of RoHS-Compliant 2D and 3D IC interconnects

التفاصيل البيبلوغرافية
المؤلف الرئيسي: Lau, John H.
التنسيق: Electronic Resource
اللغة:English
منشور في: New York, N.Y. McGraw-Hill c2011.
الطبعة:First edition.
الموضوعات:
Interconnects (Integrated circuit technology) > Reliability.
Green technology > Reliability.
Electronic books.
الوصول للمادة أونلاين:Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy