Reliability of RoHS-Compliant 2D and 3D IC interconnects

Λεπτομέρειες βιβλιογραφικής εγγραφής
Κύριος συγγραφέας: Lau, John H.
Μορφή: Electronic Resource
Γλώσσα:English
Έκδοση: New York, N.Y. McGraw-Hill c2011.
Έκδοση:First edition.
Θέματα:
Διαθέσιμο Online:Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
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