Lau, J. H. (2011). Reliability of RoHS-Compliant 2D and 3D IC interconnects (First edition.). McGraw-Hill.
Chicago Style (17th ed.) CitationLau, John H. Reliability of RoHS-Compliant 2D and 3D IC Interconnects. First edition. New York, N.Y: McGraw-Hill, 2011.
MLA (9th ed.) CitationLau, John H. Reliability of RoHS-Compliant 2D and 3D IC Interconnects. First edition. McGraw-Hill, 2011.
Warning: These citations may not always be 100% accurate.