Lua APA (7ú heag.)

Lau, J. H. (2011). Reliability of RoHS-Compliant 2D and 3D IC interconnects (First edition.). McGraw-Hill.

Lua i Stíl Chicago (17ú heag.)

Lau, John H. Reliability of RoHS-Compliant 2D and 3D IC Interconnects. First edition. New York, N.Y: McGraw-Hill, 2011.

Lua MLA (9ú heag.)

Lau, John H. Reliability of RoHS-Compliant 2D and 3D IC Interconnects. First edition. McGraw-Hill, 2011.

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