APA-referens (7:e uppl.)

Lau, J. H. (2011). Reliability of RoHS-Compliant 2D and 3D IC interconnects (First edition.). McGraw-Hill.

Chicago-referens (17:e uppl.)

Lau, John H. Reliability of RoHS-Compliant 2D and 3D IC Interconnects. First edition. New York, N.Y: McGraw-Hill, 2011.

MLA-referens (9:e uppl.)

Lau, John H. Reliability of RoHS-Compliant 2D and 3D IC Interconnects. First edition. McGraw-Hill, 2011.