Cita APA (7th ed.)

Licari, J. J., & Swanson, D. W. (2011). Adhesives technology for electronic applications: Materials, processing, reliability (2nd ed.). William Andrew. https://doi.org/10.1016/C2009-0-64364-6

Cita Chicago (17th ed.)

Licari, James J., i Dale W. Swanson. Adhesives Technology for Electronic Applications: Materials, Processing, Reliability. 2nd ed. Amsterdam: William Andrew, 2011. https://doi.org/10.1016/C2009-0-64364-6.

Cita MLA (9th ed.)

Licari, James J., i Dale W. Swanson. Adhesives Technology for Electronic Applications: Materials, Processing, Reliability. 2nd ed. William Andrew, 2011. https://doi.org/10.1016/C2009-0-64364-6.