Packages go vertical.

Stacking different chips in a package tucks a complete system into implantable devices like hearing aids. In this paper, the author describes how cell phones and wearable computers could be next

Detaylı Bibliyografya
Yayımlandı:IEEE spectrum 38, 8(duplicate) (2001).
Yazar: Goldstein, H.
Materyal Türü: Makale
Dil:English
Konular: