Packages go vertical.

Stacking different chips in a package tucks a complete system into implantable devices like hearing aids. In this paper, the author describes how cell phones and wearable computers could be next

Detaylı Bibliyografya

Yayımlandı:	IEEE spectrum 38, 8(duplicate) (2001).
Yazar:	Goldstein, H.
Materyal Türü:	Makale
Dil:	English
Konular:	Cell phones. Chip stacking. Hearing aids. Implantable devices. Integrated circuits. Vertical packaging. Wearable computers.