Packages go vertical.
Stacking different chips in a package tucks a complete system into implantable devices like hearing aids. In this paper, the author describes how cell phones and wearable computers could be next
| الحاوية / القاعدة: | IEEE spectrum 38, 8(duplicate) (2001). |
|---|---|
| المؤلف الرئيسي: | |
| التنسيق: | مقال |
| اللغة: | English |
| الموضوعات: |