00000cab a22000003a 4500 UP-99796217609688474 Buklod 20231007235718.0 m |o d | ta 110226s xx d | ||r ||||| || DENGII eng Adee, S. Winner Semiconductors The Ultimate Dielectrics is ... Nothing. pp. 39-42 This paper presents IBM air gap technology, in which wires are placed in vacuum to speed chips and save power. Air gap technology. Dielectric isolation. Microprocessor chips. IEEE spectrum 45, 1 (2008). FO UPD DENG-II Article