Analytical models and algorithms for the efficient signal integrity verification of inductance-effect-prominent multicoupled VLSI circuit interconnects.

Analytical models and algorithms for the efficient signal integrity verification of inductance-effect-prominent multicoupled VLSI circuit interconnects.

Novel signal integrity verification models and algorithms for inductance-effect- prominent RLC interconnect lines are developed by using a traveling-wave-based waveform approximation (TWA) technique. The multicoupled line responses are decoupled into the eigenmodes of the system in order to exploit...

Descrizione completa

Dettagli Bibliografici
Pubblicato in:IEEE Transactions on VLSI systems 12, 4 (2004).
Autore principale: Seongkyun Shin
Natura: Articolo
Lingua:English
Soggetti:
SPICE simulations.
VLSI circuit interconnects.
Closed form models.
Crosstalk.
Efficient computation algorithms.
Eigenmodes.
Glitches.
Inductance-effect-prominent multicoupled interconnects.
Multicoupled RLC lines.
Multicoupled line responses.
Ringing.
Signal integrity verification models.
Switching-dependent signal delay.
System eigenmodes.
Three-pole-based response signal.
Traveling-wave-based waveform approximation.