Advanced MEMS packaging - Lau, John H.; Lee, Cheng Kuo; Premachandran, C. S.; Aibin, Yu (New York McGraw-Hill, 2010)
Enabling technologies for advanced MEMS packaging -- Advanced MEMS wafer-level packaging -- Optical MEMS packaging : communications -- Optical MEMS packaging : bubble switch -- Optical MEMS : microbolometer packaging -- Bio-MEMS packaging -- Biosensor packaging -- Accelerometer packaging -- Radiofrequency MEMS switches -- RF MEMS tunable capacitors and tubable band-pass filters -- Advanced packaging of RF MEMS devices.
Keywords: Microelectromechanical systems; Microelectronic packaging