3-D Thermal-ADI a linear-time chip level transient thermal simulator.

Recent study shows that the nonuniform thermal distribution not only has an impact on the substrate but also interconnects. Hence, three-dimensional (3-D) thermal analysis is crucial to analyze these effects. In this paper, the authors present and develop an efficient 3-D transient thermal simulator...

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Bibliographic Details

Published in:	IEEE Transactions on computer-aided design of integrated circuits and systems 21, 12 (2002).
Main Author:	Ting-Yuan Wang
Format:	Article
Language:	English
Subjects:	3D Thermal-ADI. VLSI design. Alternating direction implicit method. Finite difference method. Linear-time chip-level transient thermal simulator. Temperature distribution. Three-dimensional thermal analysis.