3-D Thermal-ADI a linear-time chip level transient thermal simulator.
Recent study shows that the nonuniform thermal distribution not only has an impact on the substrate but also interconnects. Hence, three-dimensional (3-D) thermal analysis is crucial to analyze these effects. In this paper, the authors present and develop an efficient 3-D transient thermal simulator...
| Publicado en: | IEEE Transactions on computer-aided design of integrated circuits and systems 21, 12 (2002). |
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| Autor principal: | |
| Formato: | Artículo |
| Lenguaje: | English |
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