Static electromigration analysis for on-chip signal interconnects.

Static electromigration analysis for on-chip signal interconnects.

With the increase in current densities, electromigration has become a critical concern in high-performance designs. Typically, electromigration has involved the process of time-domain simulation of drivers and interconnect to obtain average, root mean square (r.m.s.), and peak current values for eac...

Ausführliche Beschreibung

Bibliographische Detailangaben
Veröffentlicht in:IEEE Transactions on computer-aided design of integrated circuits and systems 22, 1 (2003).
1. Verfasser: Blaauw, D.T
Format: Artikel
Sprache:English
Schlagworte:
Bidirectional current.
Charge transfer.
Circuit nodal formulation.
High-performance designs.
Industrial electromigration analysis tool.
Linear equations.
Microprocessor.
Multiple simultaneous switching drivers.
On-chip signal interconnects.
Simultaneous switching drivers modeling.
Static electromigration analysis.
Switching scenarios.
Unidirectional current.
Wire segments.