Chip-to-chip communication using a single flux quantum pulse.

Chip-to-chip propagation of a single flux quantum (SFQ) pulse has been demonstrated using an active multichip module (MCM) technique in which active transmitters and receivers are integrated on an MCM substrate as well as on a chip. A chip-to-chip SFQ transfer circuit has been designed and implement...

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Bibliographic Details

Published in:	IEEE Transactions on applied superconductivity 10, 2 (2000).
Main Author:	Maezawa, M.
Format:	Article
Language:	English
Subjects:	Josephson junction. Nb. Nb trilayer process. SFQ transfer circuit. Active multichip module. Chip-to-chip communication. Single flux quantum pulse. Solder-bumped flip-chip technology.