Chip-to-chip communication using a single flux quantum pulse.

Chip-to-chip communication using a single flux quantum pulse.

Chip-to-chip propagation of a single flux quantum (SFQ) pulse has been demonstrated using an active multichip module (MCM) technique in which active transmitters and receivers are integrated on an MCM substrate as well as on a chip. A chip-to-chip SFQ transfer circuit has been designed and implement...

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書目詳細資料
發表在:IEEE Transactions on applied superconductivity 10, 2 (2000).
主要作者: Maezawa, M.
格式: Article
語言:English
主題:
Josephson junction.
Nb.
Nb trilayer process.
SFQ transfer circuit.
Active multichip module.
Chip-to-chip communication.
Single flux quantum pulse.
Solder-bumped flip-chip technology.