Chip-to-chip communication using a single flux quantum pulse.

Chip-to-chip communication using a single flux quantum pulse.

Chip-to-chip propagation of a single flux quantum (SFQ) pulse has been demonstrated using an active multichip module (MCM) technique in which active transmitters and receivers are integrated on an MCM substrate as well as on a chip. A chip-to-chip SFQ transfer circuit has been designed and implement...

Descripción completa

Detalles Bibliográficos
Publicado en:IEEE Transactions on applied superconductivity 10, 2 (2000).
Autor principal: Maezawa, M.
Formato: Artículo
Lenguaje:English
Materias:
Josephson junction.
Nb.
Nb trilayer process.
SFQ transfer circuit.
Active multichip module.
Chip-to-chip communication.
Single flux quantum pulse.
Solder-bumped flip-chip technology.