Power to the package.
Electronic packaging technology focuses on where and how the silicon IC is connected into the electronic system. That makes a package the meeting place of a number of tradeoffs, whose constraining influence on what might and might not change will largely determine how the technology of the year 2003...
| 發表在: | IEEE spectrum 36, 7 (1999). |
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| 主要作者: | |
| 格式: | Article |
| 語言: | English |
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