Power to the package.
Electronic packaging technology focuses on where and how the silicon IC is connected into the electronic system. That makes a package the meeting place of a number of tradeoffs, whose constraining influence on what might and might not change will largely determine how the technology of the year 2003...
| Xuất bản năm: | IEEE spectrum 36, 7 (1999). |
|---|---|
| Tác giả chính: | |
| Định dạng: | Bài viết |
| Ngôn ngữ: | English |
| Những chủ đề: |