Ultralight lithography [IC manufacture].

Smaller IC features-in particular, narrower connecting linewidths-require the development of more precise tools. One key technology is semiconductor lithography, essentially the photographic transfer of IC features onto silicon substrates. As the wavelength of the light source used to expose IC patt...

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Опубликовано в::	IEEE spectrum 36, 7 (1999).
Главный автор:	Harned, N.
Формат:	Статья
Язык:	English
Предметы:	13.4 nm. 30 nm. IC features transfer. IC manufacture. IC patterns. Camera system. Chemically amplified photoresists. Depth of focus. Extreme ultraviolet lithography. Illumination system. Light source wavelength. Masks. Narrower connecting linewidths. Optical coatings. Optical materials. Photographic transfer. Reflective camera system. Resolution. Reticles. Semiconductor lithography. Silicon substrates.