The via squeeze.
Already less than 150 μm in diameter, vias can no longer be economically produced by mechanical drilling, as are conventional throughholes. Instead, they must be made by such alternative processes as laser ablation or the photochemical etching of thin dielectrics built up on either side of a convent...
| Published in: | IEEE spectrum 36, 10 (1999). |
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| Main Author: | |
| Format: | Article |
| Language: | English |
| Subjects: |