00000cab a22000003a 4500 UP-99796217609422125 Buklod 20231007234259.0 m |o d | ta 100817s xx d | ||r ||||| || DENGII eng Chalamala, B.R. Big and bendable [flexible plastic-based circuits]. pp. 50-56 This paper discusses the possibility of cheap and fast fabrication of high-quality, even custom, plastic-based flexible integrated circuits with the aid of the low-cost technologies of inkjet printing. An important advantage of the inkjet print process over conventional techniques is that the jet process puts the circuit material only where it is needed, whereas the conventional process puts the material down over the whole substrate and then etches most of it away. By eliminating the high-temperature, high-vacuum steps used in conventional circuit manufacture, the jet process has the potential to substantially cut the manufacturing cost. Circuit material. Conventional silicon IC. Flexible electronics. Flexible macroelectronics. Flexible plastic-based circuits. Inkjet printers. Lightweight antennas. Programmable signs. Roll-to-roll processing. Standard silicon technology. Substrate. IEEE spectrum 42, 9 (2005). FO UPD DENG-II Article