<?xml version="1.0" encoding="UTF-8"?>
<collection xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.loc.gov/MARC21/slim http://www.loc.gov/standards/marcxml/schema/MARC21slim.xsd" xmlns="http://www.loc.gov/MARC21/slim">
 <record>
  <leader>00000cab a22000003a 4500</leader>
  <controlfield tag="001">UP-99796217609294410</controlfield>
  <controlfield tag="003">Buklod</controlfield>
  <controlfield tag="005">20231007234127.0</controlfield>
  <controlfield tag="006">m    |o  d |      </controlfield>
  <controlfield tag="007">ta</controlfield>
  <controlfield tag="008">100511s        xx     d | ||r |||||   ||</controlfield>
  <datafield tag="040" ind1=" " ind2=" ">
   <subfield code="a">DENGII</subfield>
  </datafield>
  <datafield tag="041" ind1=" " ind2=" ">
   <subfield code="a">eng</subfield>
  </datafield>
  <datafield tag="100" ind1="0" ind2=" ">
   <subfield code="a">Vermesan, O.</subfield>
  </datafield>
  <datafield tag="245" ind1="0" ind2="2">
   <subfield code="a">A 500-dpi AC capacitive hybrid flip-chip CMOS ASIC</subfield>
   <subfield code="c">sensor module for fingerprint, navigation, and pointer detection with on-chip data processing.</subfield>
  </datafield>
  <datafield tag="300" ind1=" " ind2=" ">
   <subfield code="a">pp. 2288-2296</subfield>
  </datafield>
  <datafield tag="520" ind1=" " ind2=" ">
   <subfield code="a">A fingerprint detection technology that supports navigation, pointer, and fingerprint acquisition is described. The hybrid system consists of a silicon sensor substrate flip-chipped onto a mixed-signal ASIC. The sensor is linear and the finger is swiped over to scan the fingerprint. The navigation and pointer functions are based on the motion detection of the finger on the substrate sensor. Stroking and tapping the sensor substrate surface with the finger determines movement of the cursor and clicking-like mouse. To achieve 500 dpi fingerprint detection accuracy, separate process optimization for both the ASIC and the sensor substrate gives an alternative solution compared with all other silicon sensor approaches. The ASIC is 18 mm2 in 0.25-μm CMOS and the sensor is 105 mm2.</subfield>
  </datafield>
  <datafield tag="653" ind1=" " ind2=" ">
   <subfield code="a">AC capacitive sensors.</subfield>
  </datafield>
  <datafield tag="653" ind1=" " ind2=" ">
   <subfield code="a">ASIC.</subfield>
  </datafield>
  <datafield tag="653" ind1=" " ind2=" ">
   <subfield code="a">CMOS capacitive fingerprint sensors.</subfield>
  </datafield>
  <datafield tag="653" ind1=" " ind2=" ">
   <subfield code="a">Hybrid biometric system.</subfield>
  </datafield>
  <datafield tag="653" ind1=" " ind2=" ">
   <subfield code="a">Intelligent sensors.</subfield>
  </datafield>
  <datafield tag="653" ind1=" " ind2=" ">
   <subfield code="a">Mixed analog-digital integrated circuits.</subfield>
  </datafield>
  <datafield tag="653" ind1=" " ind2=" ">
   <subfield code="a">Navigation functions.</subfield>
  </datafield>
  <datafield tag="653" ind1=" " ind2=" ">
   <subfield code="a">On-chip data processing.</subfield>
  </datafield>
  <datafield tag="653" ind1=" " ind2=" ">
   <subfield code="a">Pointer functions.</subfield>
  </datafield>
  <datafield tag="653" ind1=" " ind2=" ">
   <subfield code="a">Process optimization.</subfield>
  </datafield>
  <datafield tag="653" ind1=" " ind2=" ">
   <subfield code="a">Three-in-one device.</subfield>
  </datafield>
  <datafield tag="773" ind1="0" ind2=" ">
   <subfield code="t">IEEE Journal of solid state circuits</subfield>
   <subfield code="g">38, 12 (2003).</subfield>
  </datafield>
  <datafield tag="905" ind1=" " ind2=" ">
   <subfield code="a">FO</subfield>
  </datafield>
  <datafield tag="852" ind1=" " ind2=" ">
   <subfield code="a">UPD</subfield>
   <subfield code="b">DENG-II</subfield>
  </datafield>
  <datafield tag="942" ind1=" " ind2=" ">
   <subfield code="a">Article</subfield>
  </datafield>
 </record>
</collection>
