Corrosion kinetics of SAC405 solder alloy in nitric acid and sodium chloride solutions
The recent direction from the Regulations on Hazardous Substances (RoHS) directive on Waste Electrical and Electronic Equipment to convert to lead-free alloys have challenged the semiconductor industry to find alternatives to the Sn-Pb solder currently being used in printed circuit boards and packag...
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| Formatua: | Thesis |
| Hizkuntza: | English |
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2009.
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