A Method for predicting package cracking and moisture sensitivity of non-hermetic solid state surface mount devices during reflow soldering
Non-hermetic solid state surface mount devices (SMDs) are sensitive to moisture-induced stress during solder reflow process. Two peak temperatures (245˚C and 260˚C) were used to simulate a Pb-free solder reflow process. Different failure modes were considered including: internal package cracks, ex...
| Autor principal: | |
|---|---|
| Format: | Llibre |
| Idioma: | English |