Citação norma APA

Lagsa, E. V. B. A Method for predicting package cracking and moisture sensitivity of non-hermetic solid state surface mount devices during reflow soldering.

Citação norma Chicago

Lagsa, Earl Vincent Baz. A Method for Predicting Package Cracking and Moisture Sensitivity of Non-hermetic Solid State Surface Mount Devices During Reflow Soldering.

Citação norma MLA

Lagsa, Earl Vincent Baz. A Method for Predicting Package Cracking and Moisture Sensitivity of Non-hermetic Solid State Surface Mount Devices During Reflow Soldering.

Nota: a formatação da citação pode não corresponder 100% ao definido pela respectiva norma.