APA (7e ed.) Bronvermelding

Lagsa, E. V. B. A Method for predicting package cracking and moisture sensitivity of non-hermetic solid state surface mount devices during reflow soldering.

Chicago (17e ed.) Bronvermelding

Lagsa, Earl Vincent Baz. A Method for Predicting Package Cracking and Moisture Sensitivity of Non-hermetic Solid State Surface Mount Devices During Reflow Soldering.

MLA (9e ed.) Bronvermelding

Lagsa, Earl Vincent Baz. A Method for Predicting Package Cracking and Moisture Sensitivity of Non-hermetic Solid State Surface Mount Devices During Reflow Soldering.

Let op: Deze citaties zijn niet altijd 100% accuraat.