Lagsa, E. V. B. A Method for predicting package cracking and moisture sensitivity of non-hermetic solid state surface mount devices during reflow soldering.
Chicagoスタイル(17版)引用形式Lagsa, Earl Vincent Baz. A Method for Predicting Package Cracking and Moisture Sensitivity of Non-hermetic Solid State Surface Mount Devices During Reflow Soldering.
MLA(9版)引用形式Lagsa, Earl Vincent Baz. A Method for Predicting Package Cracking and Moisture Sensitivity of Non-hermetic Solid State Surface Mount Devices During Reflow Soldering.
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