Lagsa, E. V. B. A Method for predicting package cracking and moisture sensitivity of non-hermetic solid state surface mount devices during reflow soldering.
Citación estilo ChicagoLagsa, Earl Vincent Baz. A Method for Predicting Package Cracking and Moisture Sensitivity of Non-hermetic Solid State Surface Mount Devices During Reflow Soldering.
Cita MLALagsa, Earl Vincent Baz. A Method for Predicting Package Cracking and Moisture Sensitivity of Non-hermetic Solid State Surface Mount Devices During Reflow Soldering.
Warning: These citations may not always be 100% accurate.