Lagsa, E. V. B. A Method for predicting package cracking and moisture sensitivity of non-hermetic solid state surface mount devices during reflow soldering.
توثيق أسلوب شيكاغو (الطبعة السابعة عشر)Lagsa, Earl Vincent Baz. A Method for Predicting Package Cracking and Moisture Sensitivity of Non-hermetic Solid State Surface Mount Devices During Reflow Soldering.
توثيق جمعية اللغة المعاصرة MLA (الإصدار التاسع)Lagsa, Earl Vincent Baz. A Method for Predicting Package Cracking and Moisture Sensitivity of Non-hermetic Solid State Surface Mount Devices During Reflow Soldering.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.