Chip scale package (CSP) design, materials, processes, reliability, and applications

Chip scale package (CSP) design, materials, processes, reliability, and applications

Detaylı Bibliyografya
Yazar: Lau, John H.
Diğer Yazarlar: Lee, Shi-Wei Ricky
Materyal Türü: Kitap
Dil:English
Baskı/Yayın Bilgisi: New York McGraw-Hill c1999.
Konular:
Integrated circuits > Design and construction.
Microelectronic packaging.