Chip scale package (CSP) design, materials, processes, reliability, and applications

Chip scale package (CSP) design, materials, processes, reliability, and applications

Bibliografiska uppgifter
Huvudupphovsman: Lau, John H.
Övriga upphovsmän: Lee, Shi-Wei Ricky
Materialtyp: Bok
Språk:English
Publicerad: New York McGraw-Hill c1999.
Ämnen:
Integrated circuits > Design and construction.
Microelectronic packaging.