Chip scale package (CSP) design, materials, processes, reliability, and applications

Chip scale package (CSP) design, materials, processes, reliability, and applications

Bibliografske podrobnosti
Glavni avtor: Lau, John H.
Drugi avtorji: Lee, Shi-Wei Ricky
Format: Knjiga
Jezik:English
Izdano: New York McGraw-Hill c1999.
Teme:
Integrated circuits > Design and construction.
Microelectronic packaging.