Chip scale package (CSP) design, materials, processes, reliability, and applications

Chip scale package (CSP) design, materials, processes, reliability, and applications

Библиографические подробности
Главный автор: Lau, John H.
Другие авторы: Lee, Shi-Wei Ricky
Формат: ‌
Язык:English
Опубликовано: New York McGraw-Hill c1999.
Предметы:
Integrated circuits > Design and construction.
Microelectronic packaging.