Chip scale package (CSP) design, materials, processes, reliability, and applications

Detalhes bibliográficos
Autor principal:	Lau, John H.
Outros Autores:	Lee, Shi-Wei Ricky
Formato:	Livro
Idioma:	English
Publicado em:	New York McGraw-Hill c1999.
Assuntos:	Integrated circuits > Design and construction. Microelectronic packaging.