Chip scale package (CSP) design, materials, processes, reliability, and applications

Chip scale package (CSP) design, materials, processes, reliability, and applications

Bibliografische gegevens
Hoofdauteur: Lau, John H.
Andere auteurs: Lee, Shi-Wei Ricky
Formaat: Boek
Taal:English
Gepubliceerd in: New York McGraw-Hill c1999.
Onderwerpen:
Integrated circuits > Design and construction.
Microelectronic packaging.