Chip scale package (CSP) design, materials, processes, reliability, and applications

Chip scale package (CSP) design, materials, processes, reliability, and applications

書誌詳細
第一著者: Lau, John H.
その他の著者: Lee, Shi-Wei Ricky
フォーマット: 図書
言語:English
出版事項: New York McGraw-Hill c1999.
主題:
Integrated circuits > Design and construction.
Microelectronic packaging.