Chip scale package (CSP) design, materials, processes, reliability, and applications

Détails bibliographiques
Auteur principal:	Lau, John H.
Autres auteurs:	Lee, Shi-Wei Ricky
Format:	Livre
Langue:	English
Publié:	New York McGraw-Hill c1999.
Sujets:	Integrated circuits > Design and construction. Microelectronic packaging.