Chip scale package (CSP) design, materials, processes, reliability, and applications

Chip scale package (CSP) design, materials, processes, reliability, and applications

Bibliographic Details
Main Author: Lau, John H.
Other Authors: Lee, Shi-Wei Ricky
Format: Book
Language:English
Published: New York McGraw-Hill c1999.
Subjects:
Integrated circuits > Design and construction.
Microelectronic packaging.