Chip scale package (CSP) design, materials, processes, reliability, and applications

Chip scale package (CSP) design, materials, processes, reliability, and applications

Bibliografiske detaljer
Hovedforfatter: Lau, John H.
Andre forfattere: Lee, Shi-Wei Ricky
Format: Bog
Sprog:English
Udgivet: New York McGraw-Hill c1999.
Fag:
Integrated circuits > Design and construction.
Microelectronic packaging.