Chip scale package (CSP) design, materials, processes, reliability, and applications

Chip scale package (CSP) design, materials, processes, reliability, and applications

Podrobná bibliografie
Hlavní autor: Lau, John H.
Další autoři: Lee, Shi-Wei Ricky
Médium: Kniha
Jazyk:English
Vydáno: New York McGraw-Hill c1999.
Témata:
Integrated circuits > Design and construction.
Microelectronic packaging.