Chip scale package (CSP) design, materials, processes, reliability, and applications

Chip scale package (CSP) design, materials, processes, reliability, and applications

Dettagli Bibliografici
Autore principale: Lau, John H.
Altri autori: Lee, Shi-Wei Ricky
Natura: Libro
Lingua:English
Pubblicazione: New York McGraw-Hill c1999.
Soggetti:
Integrated circuits > Design and construction.
Microelectronic packaging.