APA ציטוט

Lau, J. H., & Lee, S. R. (1999). Chip scale package (CSP): Design, materials, processes, reliability, and applications. McGraw-Hill.

Chicago Style (17th ed.) Citation

Lau, John H., and Shi-Wei Ricky Lee. Chip Scale Package (CSP): Design, Materials, Processes, Reliability, and Applications. New York: McGraw-Hill, 1999.

ציטוט MLA

Lau, John H., and Shi-Wei Ricky Lee. Chip Scale Package (CSP): Design, Materials, Processes, Reliability, and Applications. McGraw-Hill, 1999.