The handbook of machine soldering SMT and TH.

Detalles Bibliográficos
Autor principal:	Woodgate, Ralph W. 1922-
Formato:	Libro
Lenguaje:	English
Publicado:	New York Wiley c1996.
Edición:	3rd ed.
Materias:	Electronic packaging. Solder and soldering. Surface mount technology.