The handbook of machine soldering SMT and TH.

The handbook of machine soldering SMT and TH.

Bibliographische Detailangaben
1. Verfasser: Woodgate, Ralph W. 1922-
Format: Buch
Sprache:English
Veröffentlicht: New York Wiley c1996.
Ausgabe:3rd ed.
Schlagworte:
Electronic packaging.
Solder and soldering.
Surface mount technology.