Routing in the third dimension from VLSI chips to MCMs

Routing in the third dimension from VLSI chips to MCMs

Bibliographische Detailangaben
1. Verfasser: Sherwani, Naveed A.
Weitere Verfasser: Bhingarde, Siddharth, Panyam, Anand
Format: Buch
Sprache:English
Veröffentlicht: Piscataway, N.J. IEEE Press c1995.
Schlagworte:
Integrated circuits > Very large scale integration > Design and construction > Data processing.
Computer-aided design.
Multichip modules (Microelectronics) > Design and construction > Data processing.