Microelectronic system interconnections performance and modeling

Microelectronic system interconnections performance and modeling

Bibliographische Detailangaben
Weitere Verfasser: Tewksbury, Stuart K.
Format: Buch
Sprache:English
Veröffentlicht: New York IEEE Press c1994.
Schlagworte:
Microelectronic packaging > Mathematical models.
Multichip modules (Microelectronics) > Mathematical models.
Optical fibers > Joints > Mathematical models.