Microelectronic system interconnections performance and modeling

Microelectronic system interconnections performance and modeling

Dades bibliogràfiques
Altres autors: Tewksbury, Stuart K.
Format: Llibre
Idioma:English
Publicat: New York IEEE Press c1994.
Matèries:
Microelectronic packaging > Mathematical models.
Multichip modules (Microelectronics) > Mathematical models.
Optical fibers > Joints > Mathematical models.