Thermal stress and strain in microelectronics packaging

Thermal stress and strain in microelectronics packaging

Detalhes bibliográficos
Outros Autores: Lau, John H.
Formato: Livro
Idioma:English
Publicado em: New York Van Nostrand Reinhold c1993.
Assuntos:
Electronic packaging.
Microelectronic packaging.
Thermal stresses.