Solder paste in electronics packaging technology and applications in surface mount, hybrid circuits, and component assembly

Solder paste in electronics packaging technology and applications in surface mount, hybrid circuits, and component assembly

书目详细资料
主要作者: Hwang, Jennie S.
格式: 图书
语言:English
出版: [S.l.] Van Nostrand Reinhold c1989, c1992.
主题:
Printed circuits > Design and construction.
Solder pastes.
Surface mount technology.