Solder paste in electronics packaging technology and applications in surface mount, hybrid circuits, and component assembly

Solder paste in electronics packaging technology and applications in surface mount, hybrid circuits, and component assembly

Chi tiết về thư mục
Tác giả chính: Hwang, Jennie S.
Định dạng: Sách
Ngôn ngữ:English
Được phát hành: [S.l.] Van Nostrand Reinhold c1989, c1992.
Những chủ đề:
Printed circuits > Design and construction.
Solder pastes.
Surface mount technology.