Solder paste in electronics packaging technology and applications in surface mount, hybrid circuits, and component assembly

Solder paste in electronics packaging technology and applications in surface mount, hybrid circuits, and component assembly

書誌詳細
第一著者: Hwang, Jennie S.
フォーマット: 図書
言語:English
出版事項: [S.l.] Van Nostrand Reinhold c1989, c1992.
主題:
Printed circuits > Design and construction.
Solder pastes.
Surface mount technology.