Solder paste in electronics packaging technology and applications in surface mount, hybrid circuits, and component assembly
| Κύριος συγγραφέας: | |
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| Μορφή: | Βιβλίο |
| Γλώσσα: | English |
| Έκδοση: |
[S.l.]
Van Nostrand Reinhold
c1989, c1992.
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| Θέματα: |