Cita APA (7th ed.)

Hwang, J. S. (1989). Solder paste in electronics packaging: Technology and applications in surface mount, hybrid circuits, and component assembly. Van Nostrand Reinhold.

Cita Chicago (17th ed.)

Hwang, Jennie S. Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly. [S.l.]: Van Nostrand Reinhold, 1989.

Cita MLA (9th ed.)

Hwang, Jennie S. Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly. Van Nostrand Reinhold, 1989.